Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation
Quick Detail:
| Name |
Epoxy Resin 1311 |
Usage |
Epoxy floor coatings |
|
Mixing Ratio |
A: B =2:1 (By weight) | Applications |
Epoxy floor coatings,Electronic component potting epoxy compound |
silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. Potting and encapsulating compounds provide reliable long term performance for microelectronic, electronic, electrical devices.
Features:
1. No bubbles, good flatness, good gloss, high hardness
2. Cured products with good flame retardant property
3. Good acid-base resistance
4. Good moisture, water, oil, dust resistance
5. Good resistance of humidity and weather aging
6. Good heat dissipation performance
| Items | Units/conditions |
Technical Data
|
| Viscosity | Shore-D | 80-85 |
| Volume resistivity | 25℃/ Ω./ cm | 4.3x1015 |
| Surface resistivity | 25℃/ Ω. | 2.6x1014 |
| Dielectric strength | 25℃ KV/MM | 25 |
| Coefficient of linear expansion | CM/K | <6.1x10-5 |
| Glass transition temperature | ℃ | >90 |
| Temperature resistant | ℃ | -60~120 |
FAQ:
Q1: Are you trading company or manufacturer ?
A: We are factory.
Q2: How long is your delivery time?
A: It is 5-10 days if the goods are in stock. or it is 15-20 days if the goods are not instock, it is according to quantity.
Q3: What is your terms of payment ?
A: T/T,L/C.
Q4: Can I get a sample ?
A: If our present samples are ok for you. Samples are free,only need to to pay for the freight. If you want to see a sample with your logo,some sample fees will be needed.
Q5: Does you accept OEM or Customized production?
A: Yes, We are capable in developing products according to your requirements.
