1.Epoxy resin 2181 is a clear epoxy resin that cures under normal and low temperature conditions.
2.It has good leveling, natural defoaming, low viscosity, high hardness and high strength.
3.It can be cured at room temperature or by heating. Dedicated to crystal drop board, marble board, 3D floor insulation, metal floor, kitchen countertop, resin coating, high hardness coating on any surface; and other electronic parts, moisture-proof potting, secret masking, etc.
4.normal conditions can be reach a 5-7years anti yellow.
5.The maximum thickness of one potting can reach 5-7cm.
Specification:
Items |
Units/conditions |
Technical Data
|
Viscosity |
Shore-D |
80-85 |
Volume resistivity |
25℃/ Ω./ cm |
4.3x1015 |
Surface resistivity |
25℃/ Ω. |
2.6x1014 |
Dielectric strength |
25℃ KV/MM |
25 |
Coefficient of linear expansion |
CM/K |
<6.1x10-5 |
Glass transition temperature |
℃ |
>90 |
Temperature resistant |
℃ |
-60~120 |
The above performance data is typical data measured in a laboratory environment
with a temperature of 25°C and a humidity of 70%. It is for customer reference only
Operative method and tips:
1. Working environment: Please keep the plastic container clean. A, B components are strictly according to the weight ratio, accurately weighed, and stirit evenly along the inner wall of the container clockwise until it is used for 3-5 minutes.
2. According to the operating time and amount of glue deployment, to avoid waste. When the temperature is lower than 15 ° C, please pre-heat the A glue to 30 ° C and then adjust the rubber, easy to operate (low temperature, A glue will thicken ); After use must seal the lid,to avoid the product due to moisture absorption scrapped.
3. When the relative humidity is more than 85%, the surface of the cured product can easily absorb the moisture in the air to form a whitemist.Therefore,when the relative humidity is more than 85%, it is not suitable for room temperature curing. It is recommended to use the heating and curing.
4. The lid must be sealed after use to avoid the product being scrapped due to moisture absorption.
Tips:
1. If it is used to contact food after curing, the temperature of the food should not exceed 50 degrees Celsius.
2. When the hardness is higher than 82D (Shaw hardness), it can be directly polished.
3. The mixing quantity should not exceed 5kg, and the casting thickness should not exceed 3cm each layer.
4. When the temperature is higher than 25 degrees Celsius, it will cure faster, please reduce the number of mixing/casting by half, or it will be hardened in the container;
5.Curing time will be depend on room temperature and casting thickness , the room temperature higher it is, the faster curing it does. The thinner it cast the longer curing time it needs;
Packaging:
We offer different size of packaging, 5kg buckets and 20kg buckets are normal size. Customized