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White Emulsion Epoxy Resin AB Glue For Electronic Components Encapsulation

White Emulsion Epoxy Resin AB Glue For Electronic Components Encapsulation
Features Gallery Product Description Request A Quote
Product Name: Potting Electronic
Color: Black/Gray
Feature: High Thermal Conductivity
Appearance: White Emulsion
Usage: Construction, Fiber & Garment, Transportation
Function: Bonding+Sealing
High Light:

White Emulsion Epoxy Resin AB Glue


Encapsulation Epoxy Resin AB Glue


White Emulsion Epoxy Potting Compound

Basic Infomation
Place of Origin: China
Brand Name: Aorun
Model Number: Aorun AR44
Payment & Shipping Terms
Packaging Details: drums
Delivery Time: 5-8 work days
Payment Terms: L/C, D/A, D/P, T/T,, MoneyGram, Western Union
Supply Ability: 100000kg per month
Product Description


Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation
Quick Detail:



Epoxy Resin AR44


Construction, Fiber & Garment, Transportation

Mixing Ratio

A: B =3:1 (By weight) Advantages

Fine flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance





Aorun potting material for electronic components AR44 is a AB glue, rigid type, fire rated epoxy resin. It is designed specially for potting, sealing and encapsulation of electronic parts. This circuit board potting compound has good water resistance, chemical resistance, thermal shock resistance and excellent retention of electrical insulating properties with excellent bonding strength. The thermally conductive potting material AR44 can be cured at ambient temperature or at higher temperatures for improved production performance.

The thermal potting compound AR44 is a best solution for potting and encapsulation of electronic/electrical components requiring flammable retardant certification.






1.No bubbles, good flatness, good gloss, high hardness
2.Cured products with good flame retardant property
3.Good acid-base resistance
4.Good moisture, water, oil, dust resistance
5.Good resistance of humidity and weather aging
6. Good heat dissipation performance



Items Units/conditions
Technical Data
Viscosity Shore-D 80-85
Volume resistivity 25℃/ Ω./ cm 4.3x1015
Surface resistivity 25℃/ Ω. 2.6x1014
Dielectric strength 25℃ KV/MM 25
Coefficient of linear expansion CM/K <6.1x10-5
Glass transition temperature >90
Temperature resistant -60~120



The above performance data is typical data measured in a laboratory environment
with a temperature of 25°C and a humidity of 70%. It is for customer reference only

White Emulsion Epoxy Resin AB Glue For Electronic Components Encapsulation 0


Our services:



1. Instant technical support (our skype ID: chialinglee5612)

2.. Custom made products are available.

3. Strict quality control and manufacture process.

4. Free samples available.

5. Short production time (lead time).

6. Small MOQ is accepted (1kg)

7. Multi payment method (bank T/T, western union, paypal...)






1.Do you provide free sample?

Yes, we provide free sample also shipping cost is free. Our free sample is 400g you shoule bear the freight first when you make bulk order to us we will reduce from the total amount.

2.Which shipping way is available and how to track?

By sea to your nearest port By express (DHL,UPS,FEDEX,TNT,EMS)to your doorWhen ur order shipping out . we will provide u a tracking no. then u can know clearly the status of the goods

3:My package has missing products. What do I do?

Please contact our support team and we will confirm your order with the package contents. We apologize for any inconveniences!

4.Which payment way is workable?

Western Union,L/C,Paypel, Trade Assurance on AlibabaT/T (30%deposit, 70% before shipment after presentation of ready cargo)


We offer different size of packaging, 5kg buckets and 20kg buckets are normal size. Customized
White Emulsion Epoxy Resin AB Glue For Electronic Components Encapsulation 1
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Tel : 008618002155889
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